ICPCVD-200 PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION SYSTEM FOR COATINGS FROM THE GAS PHASE WITH ACTIVATION OF WORKING GASES BY INDUCTION DISCHARGE PLASMA (ICP)

Ultra PECVD-200 SYSTEM FOR PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION PROCESSES WITH CAPACITIVELY COUPLED PLASMA (CCP)

ICPRIE-200 SYSTEM FOR PLASMA CHEMICAL AND REACTIVE ION ETCHING WITH INDUCTION DISCHARGE PLASMA ACTIVATION (ICP)

Ultra RIE-200 SYSTEM FOR REACTIVE ION ETCHING WITH ACTIVATION BY CAPACITIVELY COUPLED PLASMA (CCP)