Ultra-high vacuum (UHV) sputtering system for single-sided deposition of precious metals

Features:

• Magnetron sputtering

• Resistive evaporation

• Possibility to install up to 4 technological devices

• System of substrates heating up to 400 оС

• Disc-type substrate holder (horizontal)

• Ultra-high vacuum version

Technical data:

Technological devices:

• DC magnetron

• Ion beam cleaning source

• Resistive evaporation system