System of automatic single wave optical control of the sputtering process

Features:

• Monitoring on substrates moving at high speed due to minimized measurement time

• Calibration of the reference signal eliminates any signal variations not directly related to the film deposition process

• Mathematical algorithm for approximation of measured data

• High accuracy of layer deposition process stop

User friendly interface of OCP software provides all visual information to operate process in automatic or manual mode.

Technical data: